ASML CEO says Europe is “quite behind” in AI as the US buys 80% of advanced chips
ASML CEO Christophe Fouquet said in a Bloomberg interview that Elon Musk’s Terafab initiative resembles a “million-wafer” scale fab project, comparable to large DRAM lines in South Korea. He added that the AI-driven chip capacity buildout remains in the early stages, and that delivering the necessary equipment takes time. The comments reinforce investor attention on ASML’s role as a key supplier to AI infrastructure spending, particularly for EUV systems used in advanced-node expansions.